Why Two‑Phase Direct‑to‑Chip Cooling is Reaching a Tipping Point
May 19, 2026
Modelon & University of Maryland Researchers to Present Findings at Upcoming Conference Artificial intelligence and high-performance computing (HPC) are fundamentally reshaping the way data centers are designed. Power densities continue to rise, thermal margins are tightening, and workloads are becoming more dynamic and less predictable. HGX H100 racks introduced in 2022 consumed around 40–60 kW, […]